Server

Sapphire Rapids-SP (LGA-4677-E) SKT-E + EBG PCH, 8x DDR5.

1. Single socket H3 (LGA 1150) supports Intel® Xeon® E3-1200 v3/v4, 4th/5th gen. Core i7/i5/i3 processors 2. Intel® C226 Express PCH 3. Up to 32GB DDR3 ECC/non-ECC 1600MHz UDIMM in 4 sockets 4. Dual Gigabit Ethernet LAN ports (1x Intel® i217LM & 1x Intel® i210AT)

1. Single socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 and E5-1600 v4†/ v3 family 2. Intel® C612 chipset 3. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 4. 1 PCI-E 3.0 x4 (in x8), 1 PCI-E 3.0 x8 (in x16), 2 PCI-E 3.0 x8

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 4. Riser card support: Left side - 1 PCI-E 3.0 x32

Intel® Xeon® Scalable Processors. Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP Intel® C621 Up to 3TB 3DS ECC RDIMM, DDR4-2933MHz;

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 4. Expansion slots: 4x PCI-E 3.0 x8 5. Intel® 82599ES Dual port 10G SFP+

Single AMD EPYC™ 7001/7002* Series Processor (*AMD EPYC 7002 series drop-in support requires board revision 2.x) 2.1TB Registered ECC DDR4 2666MHz SDRAM in 8 DIMMs 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs (Board revision 2.x required) Expansion slots:  3 PCI-E 3.0 x16  3 PCI-E 3.0 x8  M.2 Interface: 1 PCI-E 3.0 x4  M.2 Form Factor: 2280, 22110  M.2 Key: M-key 8 SATA 3.0 + Broadcom 3008 for 8 SAS3 ports + 2 NVMe, 1 M.2

8th Generation Intel® Core™ i3 Processors, Intel® Celeron®, Intel® Pentium®, Intel® Xeon® E processor (Coffee Lake-S) Server, Intel® Xeon® E processor (Coffee Lake-S) Workstation., Single Socket H4 (LGA 1151) supported, CPU TDP support Up to 95W TDP Intel® C246 Up to 64GB Unbuffered ECC/non-ECC UDIMM, DDR4-2666MHz, in 4 DIMM slots 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (in x16 slot), 1 PCI-E 3.0 x4, 1 PCI-E 3.0 x1, 2 PCI-Ex16 slots are running at NA/16, or 8/8 1 PCI, 1 - 5V PCI 32bit M.2 Interface: 2 PCI-E 2.0 x4, RAID 0 & 1 M.2 Form Factor: 22110 M.2 Key: M-Key M.2#1~2 are shared with SATA #6~7, M.2#2 is shared with U.2 U.2 Interface: 1 PCI-E 3.0 x4 1 HDMI port, 1 DVI - I port, 1 DP (DisplayPort) port, HDMI is HDMI2.0a, DP is DP1.2, Intel® C246 controller for 8 SATA3 (6 Gbps) ports; RAID 0,1,5,10 Single LAN with Intel® Ethernet Controller I210-AT Single LAN with Intel® PHY I219LM LAN controller Support vPro

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; UPI up to 9.6GT/s 2. Intel® C612 chipset 3. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz; 16 DIMM slots 4. 3 PCI-E 3.0 x16, 2 PCI-E 3.0 x8, and 1 PCI-E 2.0 x4 (in x8) slot 5. Dual GbE LAN ports via Intel® i210

Intel® Xeon® 6700-series processors with E-cores, Single Socket LGA-4710 (Socket E2) supported, CPU TDP supports Up to 350W TDP Up to 1TB ECC RDIMM DDR5-6400MT/s in 8 DIMM slots 6 PCIe 5.0 x8 via MCIO connectors 3 PCIe 5.0 x16, 3 PCIe 5.0 x8, M.2 Interface: 2 PCIe 5.0 x2 M.2 Form Factor: 22110

1. Single socket H3 (LGA 1150) supports Intel® Xeon® E3-1200 v3/v4, 4th gen. Core i3, Pentium, Celeron processors 2.Intel® C222 Express PCH 3. Up to 32GB DDR3 ECC 1600MHz UDIMMs in 4 sockets

3rd Gen Intel® Xeon® Scalable processors, Single Socket LGA-4189 (Socket P+) supported, CPU TDP supports Up to 270W TDP Intel® C621A Up to 2TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-3200MHz Up to 2TB Intel® Optane™ Persistent Memory 200 Series, in 8 DIMM slots 1 PCI-E 4.0 x16 Right Riser Slot, 1 PCI-E 4.0 x32 Left Riser Slot, 4 PCI-E 4.0 NVMe x4 Internal Port(s) M.2 Interface: PCI-E 3.0 x4 and SATA M.2 Form Factor: 2280, 22110 M.2 Key: M-Key Dual LAN with 1GbE with Intel® I210 Intel® C621A controller for 10 SATA3 (6 Gbps) ports; RAID 0,1,5,10 I/O: 1 VGA, 2 COM, TPM header 2 SuperDOM with built-in power