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Servers All Brands Storage Servers Supermicro SSG-6029P-E1CR16T

Supermicro SSG-6029P-E1CR16T

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 (slot 1 occupied by controller) 4. 16 Hot-swap 3.5" SAS3/SATA3

We also offer six months of free collocation in our TIER III data center.

Components are not the end — ask us for a custom server configuration. We will design the server, assemble it, expertly set it up, and provide extended or NBD warranty.

Product code 202.151990
Part number SSG-6029P-E1CR16T
EAN 672042287123
Manufacturer Supermicro
Availability Not in stock
Warranty 24 months
Weight 43 kg
The price includes all legal fees
82 595 Kč ex VAT
82 595 Kč w/ VAT
pc

Detailed information

 
Broadcom 3108 AOC



Integrated Board
Super X11DPH-T
Key Features
  - Corporate Database
  - Database Processing & Storage
  - Enterprise Server
  - HPC, Data Center
  - iSCSI SAN

 
1. Dual socket P (LGA 3647) supports
    Intel® Xeon® Scalable Processors,
    3 UPI up to 10.4GT/s
 
2. Up to 2TB ECC 3DS LRDIMM, up to
    DDR4-2666MHz; 16 DIMM slots
 
3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8
    (slot 1 occupied by controller)
 
4. 16 Hot-swap 3.5" SAS3/SATA3
    direct attached drive bays
 
5. Broadcom 3108 SAS3 AOC
 
6. 2x 10GBase-T LAN ports with
    Intel X722 + PHY Intel X557
 
7. Server remote management: IPMI 2.0
    / KVM over LAN / Media over LAN
 
8. 3 Hot-swap 8cm redundant PWM fans
 
9. 1600W Redundant Power Supplies
    Titanium Level (96%)
 
 

Product SKUs
SSG-6029P-E1CR16T
  • SuperServer 6029P-E1CR16T (Black)
 
Motherboard

Super X11DPH-T
 
Processor/Cache
CPU
  • Dual Socket P (LGA 3647)
  • Intel® Xeon® Scalable Processors,
    3 UPI up to 10.4GT/s
  • Support CPU TDP 70-205W
Cores
  • Up to 28 Cores with Intel® HT Technology
 
System Memory
Memory Capacity
  • 16 DIMM slots
  • Up to 2TB ECC 3DS LRDIMM, 512GB ECC RDIMM, DDR4 up to 2666MHz
Memory Type
  • 2666/2400/2133MHz ECC DDR4 SDRAM
 
On-Board Devices
Chipset
  • Intel® C624 chipset
SAS
  • SAS3 (12Gbps) via Broadcom 3108 AOC; HW RAID
  • RAID 0, 1, 5, 6, 10, 50, 60
SATA
  • SATA3 (6Gbps); RAID 0, 1, 5, 10
Network Controllers
  • Dual 10GBase-T LAN ports with Intel X722 + PHY Intel X557
IPMI
  • Support for Intelligent Platform Management Interface v.2.0
  • IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Video
  • ASPEED AST2500 BMC
 
Input / Output
LAN
  • 2 RJ45 10GBase-T LAN ports
  • 1 RJ45 Dedicated IPMI LAN port
USB
  • 4 USB 3.0 ports (rear)
  • 1 Type A
Video
  • 1 VGA port
Serial Port / Header
  • 1 Fast UART 16550 port / 1 Header
 
System BIOS
BIOS Type
  • 256Mb AMI UEFI
 
Management
Software
  • Intel® Node Manager
  • IPMI 2.0
  • NMI
  • SPM, SUM
  • SuperDoctor® 5
  • Watchdog
 
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory.
  • 4+1 Phase-switching voltage regulator
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-829HE1C4-R1K62LPB
 
Dimensions
Width
  • 17.2" (437mm)
Height
  • 3.5" (89mm)
Depth
  • 24.8" (630mm)
Gross Weight
  • 61 lbs (27.7 kg)
Available Colors
  • Black
 
Front Panel
Buttons
  • Power On/Off button
  • System Reset button
LEDs
  • Power status LED
  • Hard drive activity LED
  • Network activity LEDs
  • System Overheat LED
  • Power fail LED
 
Expansion Slots
PCI-Express
  • 3 PCI-E 3.0 x16 slot
  • 4 PCI-E 3.0 x8 slots
  • Slot 1 occupied by controller
 
Drive Bays
Hot-swap
  • 16 Hot-swap 3.5" SAS3/SATA3 drive bays
Optional
  • 2 Optional Onboard NVMe M.2
 
Backplane
SAS3 12Gb/s direct attached storage backplane, w/ 24x SAS3 2.5" drive slots
 
System Cooling
Fans
  • 3 Hot-swap 8cm redundant PWM cooling fans
 
Power Supply
1600W Redundant Power Supplies with PMBus
Total Output Power
  • 1000W/1600W
Dimension
(W x H x L)
  • 73.5 x 40 x 203 mm
Input
  • 100-127Vac / 13 - 9A / 50-60Hz
  • 200-240Vac / 10 - 8A / 50-60Hz
+12V
  • Max: 83.3A / Min: 0A (100-127Vac)
  • Max: 133A / Min: 0A (200-240Vac)
12Vsb
  • Max: 2.1A / Min: 0A
Output Type
  • 25 Pairs Gold Finger Connector
Certification Titanium Level96%  UL/cUL/CB/BSMI/CE/CCC
  Titanium Level
  Test Report ]
 
Operating Environment
RoHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature: 
       10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature: 
       -40°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 
       8% to 90% (non-condensing)
  • Non-operating Relative Humidity: 
       5% to 95% (non-condensing)
 
Parts List - (Items Included)
 
Part Number
Qty
Description
Motherboard / Chassis MBD-X11DPH-T 
 
CSE-829HE1C4-R1K62LPB
1
 
1
Super X11DPH-T Motherboard
 
2U Chassis
Add-on Card / Module AOC-S3108L-H8IR-16DD-P 1 AOC-S3108L-H8iR-16DD
Backplane BPN-SAS3-826EL1-N4 1 12-port 2U SAS3 12Gbps single-expander backplane, support up to 8x 3.5-inch SAS3/SATA3 HDD/SSD and 4x NVMe/SAS3/SATA3 storage devices
Backplane BPN-SAS3-829HA-A4 1 4-port internal SAS3 12Gbps backplane, support up to 4x 3.5-inch SAS3/SATA3 HDD/SSD
Cable 1 CBL-SAST-0532 2 MINI SAS HD,12G,INT,50CM,30AWG
Parts MCP-220-82616-0N 1 12G 2.5x2 Drive Kit w/ Status LED(216B/826B/417B/846X/847B)
Parts MCP-260-00042-0N 1 STD I/O shield for X9 socket R server MB with Gasket.
Heatsink / Retention SNK-P0067PSWB 1 1U Proprietary 96-mm Wide Passive CPU Heat Sink for X11 Purley Platform Equipped with a Narrow Retention Mechanism
Heatsink / Retention SNK-P0068APS4 1 2U Active CPU Heat Sink Supporting Narrow Bolster Plate Mounting Mechanism for X11 Purley Platform
Power Supply PWS-1K62A-1R 2 AC-DC 1600W, Titanium Level, Redundancy, 1U, DC Output: +12V and +12Vs, 203 x 73.5 x 40 mm, AC Input: 90 - 264 VAC/47-63Hz, PMBus 1.2 with DSP controller,HF,RoHS/REACH
FAN 1 FAN-0158L4 4 80x80x38 mm, 10.5K RPM, Optional Middle Cooling Fan for X10 2U Ultra and HFT Series Servers,RoHS/REACH

Parameters

Size in U 2
Depth (mm) 705
CPU manufacturer Intel
Socket 3647
HDD disks 18
2.5" Drive bays 2
3.5" Drive bays 16
NVMe slots 4
Total amount of PCIe 7
OCP/AIOM 0
Power (W) 1600
Efficiency certification Titanium

Price development



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