Enterprise-Optimized Storage

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. 3 PCI-E 3.0 x8 (1 FHHL, 2 LPHL) expansion slots per controller; up to 3 add-on cards 4. Dual 10GBase-T LAN w/ Intel® X540; 100Mb private Ethernet between controller nodes 5. 16x 3.5" Hot-swap SAS3/SATA3 drive bays with SES2 6. SAS3 via Broadcom 3008 controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 12x 4cm PWM cooling fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

1. Single socket P (LGA 3647) supports Intel® Xeon® Scalable Processors 2. Up to 1TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 8 DIMM slots 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x8, 1 PCI-E 3.0 x4 (in x8) 4. 2x 10GBase-T with Intel® X557 5. 36 Hot-swap 3.5" SAS/SATA drive bays with SES3 (24 front + 12 rear); 4 Internal fixed 2.5" drive bays 2 Hot-swap 2.5" NVMe/SATA (rear, optional) 6. SAS3 via Broadcom 3008 controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 7 High-performance 8cm PWM fans 9. 1200W Redundant Power Supplies Titanium Level (96%)

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. 3 PCI-E 3.0 x8 (1 FHHL, 2 LPHL) expansion slots per controller 4. Dual 10GBase-T LAN w/ Intel® X540; 100Mb private Ethernet between controller nodes 5. 24x 3.5" Hot-swap SAS drive bays with SES2 6. SAS3 via Broadcom 3008 controller 7. Server remote management: IPMI 2.0 / KVM over LAN / Media over LAN 8. 4x 8cm and 4x 4cm PWM cooling fans 9. 1600W Redundant Power Supplies Titanium Level (96%)

1. Dual socket P (LGA 3647) supports Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots 3. 3 PCI-E 3.0 x16, 4 PCI-E 3.0 x8 4. 24 Hot-swap 2.5" SAS3/SATA3 direct attached drive bays

1. Supports AMD Instinct™ MI200 Series Accelerators with AMD Infinity™ Fabric™ GPU-GPU Interconnect, 1:1 GPU-to-NIC ratio 2. Supports MI250 OAM Accelerator with 128GB (HBM2e) and Infinity Interconnect 3. Supports HGX A100 4-GPU 4. Dual AMD EPYC™ 7003 Series Processors 5. 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs

1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1 PCI-E 3.0 x16, 6 PCI-E 3.0 x8

DIMM Sizes: 32GB, 16GB, 8GB, 4GB, 2GB, 1GB Cache: Up to 30MB Hot-swap: 12x Hot-swap 3.5" SAS/SATA HDD trays Optional OS Drive: 2x Rear 2.5" Hot-swap Drive Bays